Very high performance adhesive
PUR adhesive TAKA 2308.45P
Viscosity at 140°
45000+/-10000 mPa.s
Open time (m.i)
50"-60"
Setting time (m.i)
6"-8"
Crosslinking
2-3 Days
Support
MDF - Chipboard - Wood
Amount of glue
70-90 g/m²
Application temperature
130-160 °C
Packs
2-20-200 kg
Features
2308.45P has been formulated for the wrapping of profiles and panels where a high initial bond is required, panels and profiles with difficult geometries (“J-pull” sashes) or the use of very rigid foils (CPL). 2308.45P is very popular for laminating door jambs with CPL decors. For ennobling with CPL foils, the material is heated above 80°C in order to be formed without breaking the decor.
Features
2308.45P has a high bonding strength at high temperatures so that at the output of the laminating machine it holds the décor together and avoids ungluing due to the high temperature applied to the CPL décor. Thanks to its good open time, the adhesive can be used for all substrates (wood, blockboard, plywood, chipboard and MDF) and with all decors.
