2308.55 is an adhesive for wood and wood-based profiles and panels (chipboard and MDF).
It is characterized by a long open time and excellent wettability.
It is compatible with paper decors and thin plastic foils.
What makes it unique is its high melt rate that allows melting even at low temperatures (100-120°C) to bond heat-sensitive decors.
2308.55 is compatible with decors used in the furniture industry such as papers of various thicknesses and thin plastic foils (PET, PVC, PP).
