2308.55 is an adhesive for wood and wood-derived profiles and panels (chipboard and MDF).
It is characterized by long open time and excellent wettability.
It is compatible with paper decors and thin plastic films.
What makes it unique is its high melt rate that allows even at low glue melting temperatures (100-120°C) to bond even heat-sensitive decors.
2308.55 is compatible with decors used in the furniture-furniture industry such as papers of various thicknesses, thin plastic films (PET, PVC, PP).
